Liwen Zhu

Research Project

Curing of Composites using Internal Resistive Heating

Curing of net-shaped fiber-resin layups is the common and critical step in the fabrication processes for thermosetting-matrix composite products. Significant improvements in the processing cycle time and cure uniformity may be realized through the use of embedded conductive elements generating internal resistive heating during the process. The research presents a detailed numerical investigation of the cure process in the presence of embedded resistive heating sources supplementing a conventional external heating schedule. A numerical model, validated with experimental data, is utilized to explore the process over a wide range of resistive heating configurations, and dimensionless groups encompassing process and material parameters. Based on a systematic parametric analysis, feasible operating regimes and optimal embedded heating configurations are identified with the objective of minimizing the fabrication time subject to constraints.

Publications

1. B. Ramakrishnan, L. Zhu, and R. Pitchumani, “Curing of Composites Using Internal Resistive Heating,” ASME Journal of Manufacturing Science and Engineering, 122(1), 124–131, 2000.
2. L. Zhu and R. Pitchumani, “Analysis of a Process for Curing Composites by the Use of Embedded Resistive Heating Elements,” Composites Science & Technology, 60, 2699–2712, 2000.
3.  L. Zhu and R. Pitchumani, “Processing Envelopes for Supplemental Internal Resistive Heating During Composites Cure,” Journal of Reinforced Plastics and Composites, 18(13), 1242–1253, 1999.
4. B. Ramakrishnan, L. Zhu and R. Pitchumani, “Resistive Curing of Composite Materials,” in Proceedings of the 2000 NSF Design & Manufacturing Research Conference, January 3-6, 2000, Vancouver, BC, 10pp.
5. B. Ramakrishnan, L. Zhu and R. Pitchumani, “Accelerated Curing of Composites Using Supplemental Internal Resistive Heating,” Proceedings, Int. SAMPE Symposium & Exhibition, 43(1), pp. 243–253, 1998.
6. L. Zhu and R. Pitchumani, “Processing Envelopes for Supplemental Internal Resistive Heating during Thermosetting Composites Cure,” Proceedings of the Eighth Japan-US Conference on Composites, G. Newaz and R. Gibson, eds., pp. 122–132, 1998.

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